The AI revolution is starving its own supply base
Every HBM stack, the heart of AI accelerators, is far less dense than a commodity DRAM die: the same bit capacity takes up nearly three times the silicon area, because you add logic layers, TSV interconnects and worse yields. The upshot is that as Samsung, SK Hynix and Micron redirect more and more wafer capacity to HBM and to the newest DDR5, a disproportionately large chunk of commodity memory supply disappears from the market.