Each new generation of AI training clusters increases not so much the number of processors as the density of the links between them. Scale-up and scale-out topologies mean that a single GPU today comes with a dozen-plus optical links, and eventually several dozen. It is the network, not the silicon itself, that is becoming the fastest-growing line item in a data center budget, and it is the network that sets the pace of the build-out.
To keep up, the market is moving from 400G modules through 800G to 1.6 Tb/s. What matters is not the headline speed but the jump from 100 to 200 gigabits per optical lane. At that rate, cheap directly modulated DFB lasers no longer suffice and you have to reach for externally modulated lasers, i.e. EMLs. Those in turn are grown by epitaxy on indium phosphide (InP) substrates, a process that is technologically far harder and far more capacity-constrained than making ordinary silicon chips.